The following tables provide an overview of our 4 and 6 layer PCB constructions. All core and prepreg materials are FR-4 laminates. Additional information can be found on our materials can be found on Manufacturing Capabilities. If you need any additional information, please contact us by chat or e-mail: [email protected].
4 Layer MLB 0.062″ Thickness
| Silkscreen | White Epoxy Based | |
| Soldermask | Green, LPI | |
| Copper Plate | 0.0008″ min avg in holes | |
| Layer 1 | Copper Foil | 1/2oz |
| Prepreg | 0.0141″ | |
| Layer 2 | Copper | 1oz |
| Core | .028″ | |
| Layer 3 | Copper | 1oz |
| Prepreg | 0.0141″ | |
| Layer 4 | Copper Foil | 1/2 oz |
| Copper Plate | 0.0008″ min avg in holes | |
| Soldermask | Green, LPI | |
| Silkscreen | White, Epoxy based |
6 Layer MLB 0.062″ Thickness
| Silkscreen | White Epoxy Based | |
| Soldermask | Green, LPI | |
| Copper Plate | 0.0008″ min avg in holes | |
| Layer 1 | Copper Foil | 1/2oz |
| Prepreg | 0.0084″ | |
| Layer 2 | Copper | 1oz |
| Core | .014″ | |
| Layer 3 | Copper | 1oz |
| Prepreg | 0.0084″ | |
| Layer 4 | Copper | 1 oz |
| Core | .014″ | |
| Layer 5 | Copper | 1oz |
| Prepreg | 0.0084″ | |
| Layer 6 | Copper Foil | 1/2oz |
| Copper Plate | 0.0008″ min avg in holes | |
| Soldermask | Green, LPI | |
| Silkscreen | White, Epoxy based |